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堿性蝕刻液

、產品簡介:
I Product Introduction
PC-500堿性蝕刻液為高速、高含銅量,針對細線路特別設計之電路板蝕刻液,藥液穩定,且適合各種如錫、錫鉛、鎳、金等抗蝕刻材料。
PC-500 alkaline etching solution is specially designed for thin circuit, it has high velocity and high content of copper as well as stable property, and it is applicable for such anti-etching materials as tin, tin-lead, nickel and gold.

二、
產品優勢
II Product Advantages
1、高穩定性,不會沉淀,維護容易;
1. High stability, no deposit and easy maintenance;
2、可調控高速蝕刻速率;
2. Adjustable etching velocity;
3、高銅含量;
3. High content of copper;
4、良好的水洗性;
4. Good washing ability;
5、可用自動添加方法控制生產;
5. Use automatic adding method to control production;
6、低側蝕;
6. Low side-etching;
7、適合各種抗蝕刻材料。
7. Be applicable for various anti-etching materials;

三、操作條件

III Operating Conditions

操作條件
Operating Condition
范圍
Scope
最適值
Optimum Value
氯離子
Chloride ion
170-200g/L  180g/L
銅含量
Copper content
130-170g/L  150g/L
PH 8.1-8.8 8.3-8.5
比重
Specific gravity
1.19-1.230 1.215
溫度
Temperature
45-54℃ 50℃
蝕刻速度
Etching velocity
2.4-3.2米/分 依設備及溫度而差異
Different according to equipment and temperature
備注:連續生產時,須裝冷凍設施
Remark: install freezing device for continuous production

四、配槽方法

IV Preparetion Method
1、用水清洗后,排放完全再貫注清水,打開噴灑馬達操作10分鐘后排出槽內用水;
1. After cleaning with water, drain out all water and pour in clean water, open spraying motor to operate for 10 minutes and then drain out water in bath;
2、貫注5-10%稀鹽酸、打開噴灑馬達操作30分鐘,再排掉所有槽內用水;
2. Pour in 5-10% diluted HCL, open spraying motor to operate for 30 minutes, and drain out all water in bath;
3、改用清潔水重復步驟(2),檢查管路是否漏水;
3. Use clean water to repeat step (2) and check if the pipeline leaks water;
4、卸下所有噴嘴,浸漬于10%鹽酸溶液中,清洗阻塞,裝回噴嘴;
4. Disassemble all nozzles and dip them in 10% HCL solution to clean blocks and install the nozzles;
5、貫注5%氨水,打開噴灑馬達操作30分鐘,再排掉所有槽內用水;
5. Pour in 5% ammonia, open spraying motor to operate for 30 minutes and drain out all water in bath;
6、改用清潔水,重復步驟(5);
6. Use clean water to repeat step (5);
7、貫注母液,打開溫度控制閥,檢查PH、比重、氯離子、銅含量并確保在范圍內,開始生產。
7. Pour in mother liquid, open temperature controlling valve, check PH, specific gravity, chloride ion and copper content, and make sure they are within scope, and then start production.

五、分析方法

V Analysis Method
氯含量分析:
Analysis of Chlorine Content
1、取10mL PC-500(子、母)蝕刻液,置于250mL容量瓶中;
1. Take 10ml PC-500 (son, mother) etching liquid, and place it in a 250ml flask;
2、往容量瓶中加2~3mL氨水,用蒸餾水稀釋至刻度;
2. Add 2-3ml ammonia in flask, and use distilled water to dilute it to scale;
3、從250mL容量瓶中吸取5mL溶液,放入250mL錐形瓶中,加100mL DI水;
3. Take 5ml solution from the 250ml falsk, and place it in a 250ml conical flask, and add 100ml DI water;
4、加1mL5%鉻酸鉀指示劑,另加5mL 2%醋酸,溶液變亮黃色;
4. Add 1ml 5% potassium chromate indicator, and add 5ml 2% acetic acid, the solution turns to be bright yellow;
5、 用標準0.1N硝酸銀溶液滴定至微紅棕色。
5. Use standard 0.1N silver nitrate for titration till the color becomes light reddish brown;
計算:氯含量(g /L)=17.75*(0.1N硝酸銀溶液毫升數)
Calculation: chlorine content (g/L) = 17.75* (ml of 0.1N silver nitrate solution)

銅含量分析
Analysis of Copper Content
1、取上述稀釋PC-—500蝕銅液10mL,放入250 mL錐形瓶中;
1. Take 10ml diluted PC—500 etching solution and place it in a 250ml conical flask;
2、 加50 mL蒸餾水;
2. Add 50ml distilled water;
3、加氨水數滴至清亮深藍色;
3. Add several drops of ammonia for titration till the solution becomes bright dark blue;
4、 加MX(紫脲酸胺)指示劑0.1克;
4. Add 0.1g MX (Murexide) indicator;
5、用標準0.1N EDTA溶液滴定至紫紅色。
5. Use standard 0.1N EDTA solution for titration till the solution becomes carmine;
計算:銅含量(g /L)=15.885×V(0.1N EDTA溶液毫升量)
Calculation: copper content (g/L) = 15.885×V(ml of 0.1N EDTA solution)

PH
值測定
Measurement of PH Value
1、取200 mL藥液于200mL燒杯中;
1. Take 200ml solution and place it in a 200ml beaker;
2、以4.0 和7.0 標準液校正PH計;
2. Use 4.0 and 7.0 standard solution to calibrate PH meter;
3、緩慢將PH電極放入燒杯中,準備讀取PH計顯示值為實測PH值。
3. Place PH pole slowly in beaker and read the value on PH meter as the measured value.

六、產品性質

VI Product Nature
品 名
Product name
外 觀
Appearance
比 重
Specific Gravity
P H 氯 離 子
Cl ion
PC-500 無色透明液體
Colorless transparent liquid
1.03±0.02 9.3±0.3 180±20g/L

七﹑安全防護
VII Safety Protection
PC-500為堿性液體,使用時請佩戴眼罩、手套及穿安全防護衣。若藥液不慎濺及皮膚、眼睛時應用大量清水清洗,嚴重者應立即就醫診治。
PC-500 is acid liquid, and when using it, please wear eyeshade, gloves and protective clothes; in case that solution spatters into eye or on skin, immediately flush with plenty of clean water and get medical treatment if necessary.

八、操作問題、原因及對策說明

VIII Description to Operating Problem, Reason and Policy

問題
Problem
原因
Reason
對策
Policy
速度慢
Slow
銅含量太高或太低
Copper content is too high or too low
調整銅含量或控制器比重設定值
Adjust copper content or the set controller specific gravity
溫度過低
Temperature is too low
升高溫度
Increase temperature
壓力偏低
Pressure is low
調整壓力
Adjust pressure
氯離子偏低
Chloride ion content is too low
添加蝕刻鹽
Add etching salt
PH偏低
Low PH
減少抽風量或添加氨水
Reduce induced draft or add ammonia
打氣不足
Insufficient blowing
加大打氣
Increase blowing
側蝕太大
Over side-etching
PH太高
High PH
增加抽風量或含銅量加水或氨水稀釋
Increase induced draft or copper content, add water or ammonia to dilute
壓力太高
Pressure is too high
降低壓力
Reduce pressure
速度太慢
Slow
調整傳送速度
Adjust transmittal velocity
氯離子過高
Chloride ion content is too high
加子液或加水
Add son solution or water
銅厚度不均勻
Copper thickness is not average
改善鍍銅均勻度
Improve average of copper-plating
沉淀
Deposit
銅含量過高
Copper content is too high
添加子液
Add son solution
PH過低
Low PH
添加氨水、減少抽風
Add ammonia and reduce induced draft
氯離子太低
Chloride ion content is too low
添加蝕刻鹽
Add etching salt
漏水
Leak water
檢查冷卻管或水洗水滲漏
Check colling pipe or leakage of washing water


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